Description
IC FPGA 60K GATES 128KB 256FBGA Series: SmartFusion? Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 MCU Flash: 128KB MCU RAM: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0~C ~ 85~C Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)
Part Number | A2F060M3E-FGG256 |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Microsemi |
Description | IC FPGA 60K GATES 128KB 256FBGA |
Series | SmartFusion |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | ARM Cortex-M3 |
MCU Flash | 128KB |
MCU RAM | 16KB |
Peripherals | DMA, POR, WDT |
Connectivity | EBI/EMI, I²ÂC, SPI, UART/USART |
Speed | 80MHz |
Primary Attributes | ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature | 0°C ~ 85°C (TJ) |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FBGA (17x17) |
Image |
A2F060M3E-FGG256
Microsemi Commercial Components Group
5000
0.34
HK HEQING ELECTRONICS LIMITED
A2F060M3E-FGG256
MICROS
16000
1.68
Finestock Electronics HK Limited
A2F060M3E-FGG256
MICROSEM
37500
3.02
Cinty Int'l (HK) Industry Co., Limited
A2F060M3E-FGG256
Microse
3000
4.36
HONG KONG YUE JIN PENG ELECTRONICS CO.
A2F060M3E-FGG256
MICRONS
15000
5.7
Riking Technology (HK) Co., Limited