Description
IC FPGA 512K FLASH 256FPBGA Series: SmartFusion? Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 MCU Flash: 512KB MCU RAM: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0~C ~ 85~C Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)
Part Number | A2F500M3G-1FGG256 |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Microsemi |
Description | IC FPGA 512K FLASH 256FBGA |
Series | SmartFusion |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | ARM Cortex-M3 |
MCU Flash | 512KB |
MCU RAM | 64KB |
Peripherals | DMA, POR, WDT |
Connectivity | EBI/EMI, Ethernet, I²ÂC, SPI, UART/USART |
Speed | 100MHz |
Primary Attributes | ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Operating Temperature | 0°C ~ 85°C (TJ) |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FBGA (17x17) |
Image |
A2F500M3G-1FGG256
Microsemi Commercial Components Group
16000
0.41
Finestock Electronics HK Limited
A2F500M3G-1FGG256
MICROS
5000
1.145
HK HEQING ELECTRONICS LIMITED
A2F500M3G-1FGG256
MICROSEM
6305
1.88
Dedicate Electronics (HK) Limited
A2F500M3G-1FGG256
Microse
3000
2.615
HONG KONG YUE JIN PENG ELECTRONICS CO.
A2F500M3G-1FGG256
MICRONS
15000
3.35
Riking Technology (HK) Co., Limited