Description
IC FPGA 500K GATES 512KB 256FBGA Series: SmartFusion? Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 MCU Flash: 512KB MCU RAM: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55~C ~ 125~C Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)
Part Number | A2F500M3G-1FGG256M |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Microsemi |
Description | IC FPGA 500K GATES 512KB 256FBGA |
Series | SmartFusion |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | ARM Cortex-M3 |
MCU Flash | 512KB |
MCU RAM | 64KB |
Peripherals | DMA, POR, WDT |
Connectivity | EBI/EMI, Ethernet, I²ÂC, SPI, UART/USART |
Speed | 100MHz |
Primary Attributes | ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Operating Temperature | -55°C ~ 125°C (TJ) |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FBGA (17x17) |
Image |
A2F500M3G-1FGG256M
Microsemi Commercial Components Group
5000
0.67
HK HEQING ELECTRONICS LIMITED
A2F500M3G-1FGG256M
MICROS
16000
1.455
Finestock Electronics HK Limited
A2F500M3G-1FGG256M
MICROSEM
37500
2.24
Cinty Int'l (HK) Industry Co., Limited
A2F500M3G-1FGG256M
Microse
12000
3.025
YO CHIP(HONG KONG)TRADING CO LIMITED
A2F500M3G-1FGG256M
MICRONS
3000
3.81
HONG KONG YUE JIN PENG ELECTRONICS CO.